Development of a SEM-E format computer-a mechanical perspective

Author

Faris, Jeffrey E.

Author_Institution

Texas Instrum. Inc., Dallas, TX, USA

fYear

1990

fDate

21-25 May 1990

Firstpage

125

Abstract

The mechanical hardware design challenges of implementing SEM-E format modules for a mission processor computer are examined. The computer consists of an air-cooled chassis, a high-density backplane, 18 digital SEM-E modules, five SEM-E format power supply modules, a power conditioner, and the internal wire harnesses. The complete computer weighs less than 78 pounds, and is approximately the size of a 3/4 ATR long chassis. The computer requires less than 400 watts of three-phase, 400-Hz AC power. A common thermal environment is provided for all modules. All modules are of surface mount construction and have aluminium covers that provide vibration, ESD (handling), and EMI (electromagnetic interference) survivability. This mission processor is designed for flightworthy applications. Formalized analysis and testing of the system verified the integrity of the processor

Keywords

Texas Instruments computers; microcomputers; military computing; military equipment; modules; special purpose computers; vibrations; 400 Hz; 400 W; AC power; EMI; ESD; SEM-E format computer; Texas Instruments; air-cooled chassis; internal wire harnesses; mechanical design; mechanical hardware design; military equipment; mission processor computer; power conditioner; power supply modules; surface mount construction; survivability; thermal environment; vibration; Aluminum; Backplanes; Electromagnetic interference; Electrostatic discharge; Electrostatic interference; Hardware; Modular construction; Power supplies; Vibrations; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Aerospace and Electronics Conference, 1990. NAECON 1990., Proceedings of the IEEE 1990 National

Conference_Location

Dayton, OH

Type

conf

DOI

10.1109/NAECON.1990.112753

Filename

112753