Automated visual inspection for IC wire-bond using auto-focusing technique

Author

Lim, Han Ooi ; Zhang, Wei ; Koh, Liang Mong

Author_Institution

Nanyang Technol. Univ., Singapore

fYear

1993

fDate

4-6 Oct 1993

Firstpage

31

Lastpage

36

Abstract

An automated integrated circuit (IC) wire-bond inspection system has been successfully developed. The system is capable of measuring the height and diameter of the bonds. The bond height is detected by automatically computing the focused planes of the top and the base of the bond with a series of two-dimensional images of the bond. The focused plane of an image is obtained by extracting the high-frequency features of the image. By scanning horizontally and vertically for a steep change in gray level of the image, the diameter of the bond is calculated. The system carries out the measurement task at a speed of six bonds per minute. Precision of ±0.9 μm and ±2.0 μm for the height and diameter measurement can be obtained

Keywords

automatic optical inspection; computer vision; diameter measurement; feature extraction; height measurement; integrated circuit testing; lead bonding; spatial variables measurement; IC wire-bond; auto-focusing technique; automated visual inspection; bond diameter; bond height; focused planes; high-frequency features; image processing; two-dimensional images; Costs; Feature extraction; Focusing; Humans; Inspection; Integrated circuit technology; Lenses; Microscopy; Semiconductor device measurement; Stereo vision;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International

Conference_Location

Santa Clara, CA

Print_ISBN

0-7803-1424-7

Type

conf

DOI

10.1109/IEMT.1993.398225

Filename

398225