Practical application of fine pitch component mounting with precoat soldering

Author

Amano, Toshiaki ; Shiroishi, Hirokazu ; Kohno, Masanao ; Obara, Yuichi

Author_Institution

Furukawa Electric Co., Ltd., Hiratsuka, Japan

fYear

1993

fDate

4-6 Oct 1993

Firstpage

22

Lastpage

30

Abstract

By combining the key capability of Super Solder precoat to supply high volumes of solder with the new pad geometry, major improvements are demonstrated in volume production mountability and mounting reliability for fine pitch components. In particular, a solder precoat supporting repair of a 0.3 mm pitch tape automated bonding (TAB) components is possible. A pad design permitting reflow mounting of quad flatpack (QFP) packages is discussed

Keywords

fine-pitch technology; lead bonding; packaging; reflow soldering; surface mount technology; tape automated bonding; PWB; SMT; Super Solder precoat; TAB components repair; fine pitch component mounting; mounting reliability; pad design; pad geometry; precoat soldering; quad flatpack packages; reflow mounting; volume production mountability; Bridges; Chemical technology; Electronics packaging; Laboratories; Lattices; Lead; Production; Semiconductor device packaging; Soldering; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International

Conference_Location

Santa Clara, CA

Print_ISBN

0-7803-1424-7

Type

conf

DOI

10.1109/IEMT.1993.398226

Filename

398226