Evaluate the dielectric thickness variation of thin-film microstrip line by time domain reflectometry

Author

Chao, Fang-Lin

Author_Institution

Ind. Technol. Res. Inst., Hsinchu, Taiwan

fYear

1993

fDate

4-6 Oct 1993

Firstpage

11

Lastpage

13

Abstract

The impedance distribution measured by time domain reflectometry is utilized in estimating the thickness variation of the dielectric layer in a thin-film microstrip line. The relationship between dielectric thickness and impedance variation is derived based on an approximate formula. Measurements are carried out and a maximum linear fitting algorithm is proposed to correct the series resistance effect in the time domain reflectometer (TDR) data

Keywords

electric impedance measurement; microstrip lines; multichip modules; substrates; thickness measurement; time-domain reflectometry; MCM substrate; MCM-D; dielectric thickness variation; impedance distribution; maximum linear fitting algorithm; series resistance effect; thin-film microstrip line; time domain reflectometry; Dielectric measurements; Dielectric substrates; Dielectric thin films; Impedance measurement; Microstrip; Reflectometry; Thickness measurement; Time measurement; Transmission line measurements; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International

Conference_Location

Santa Clara, CA

Print_ISBN

0-7803-1424-7

Type

conf

DOI

10.1109/IEMT.1993.398229

Filename

398229