Title :
Evaluate the dielectric thickness variation of thin-film microstrip line by time domain reflectometry
Author_Institution :
Ind. Technol. Res. Inst., Hsinchu, Taiwan
Abstract :
The impedance distribution measured by time domain reflectometry is utilized in estimating the thickness variation of the dielectric layer in a thin-film microstrip line. The relationship between dielectric thickness and impedance variation is derived based on an approximate formula. Measurements are carried out and a maximum linear fitting algorithm is proposed to correct the series resistance effect in the time domain reflectometer (TDR) data
Keywords :
electric impedance measurement; microstrip lines; multichip modules; substrates; thickness measurement; time-domain reflectometry; MCM substrate; MCM-D; dielectric thickness variation; impedance distribution; maximum linear fitting algorithm; series resistance effect; thin-film microstrip line; time domain reflectometry; Dielectric measurements; Dielectric substrates; Dielectric thin films; Impedance measurement; Microstrip; Reflectometry; Thickness measurement; Time measurement; Transmission line measurements; Voltage;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-1424-7
DOI :
10.1109/IEMT.1993.398229
