Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium

fYear

1993

fDate

4-6 Oct. 1993

Abstract

The following topics are dealt with: inspection and testing; line pitch interconnect; process modeling; interconnect reliability; CFC elimination and environmental issues; manufacturing operations; statistical methods; multichip module design; manufacturing management and practices; integrated design and manufacturing; high speed interconnect design and analysis; intelligent manufacturing and closed loop control; and low cost multichip modules

Keywords

circuit reliability; closed loop systems; computer integrated manufacturing; electronics industry; environmental factors; fine-pitch technology; inspection; integrated circuit manufacture; intelligent control; multichip modules; packaging; printed circuit manufacture; printed circuit testing; process control; semiconductor device manufacture; statistical process control; surface contamination; CFC elimination; closed loop control; electronics manufacturing technology; environmental issues; high speed interconnect design; inspection and testing; integrated design and manufacturing; intelligent manufacturing; interconnect reliability; line pitch interconnect; low cost multichip modules; manufacturing management; manufacturing operations; multichip module design; process modeling; statistical methods;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International

Conference_Location

Santa Clara, CA, USA

Print_ISBN

0-7803-1424-7

Type

conf

DOI

10.1109/IEMT.1993.398232

Filename

398232