DocumentCode :
2666366
Title :
A compact model for MM-wave transmission lines and interconnects on lossy CMOS substrates
Author :
Akour, Amneh ; Khalil, Waleed ; Volakis, John ; Ismail, Mohammed
Author_Institution :
Analog VLSI, Labs., Ohio State Univ., Columbus, OH, USA
fYear :
2010
fDate :
12-15 Dec. 2010
Firstpage :
503
Lastpage :
506
Abstract :
A methodology for generating a scalable compact model for on-chip transmission lines and interconnects on lossy silicon substrate is presented. The model is demonstrated over 20-60 GHz frequency band using two types of transmission lines built in TSMC´s 0.18 μm CMOS technology. Several Coplanar Waveguides (CPW) and Microstrip lines are designed with different lengths to verify the accuracy and scalability of the extracted model. The compact model shows an excellent agreement with measured data with maximum deviation in S11 magnitude and phase of 9.2% and 5.6%, respectively, and maximum deviation in S21 magnitude and phase of 10.1% and 6.6%, respectively. Compared to existing model extraction methodologies, the required time for generating the compact model and simulating transmission lines is reduced significantly. The generated models are fully compatible with all commercial circuit simulators.
Keywords :
CMOS integrated circuits; circuit simulation; coplanar waveguides; field effect MIMIC; field effect MMIC; integrated circuit interconnections; microstrip lines; CPW; TSMC CMOS technology; circuit simulator; coplanar waveguide; frequency 20 GHz to 60 GHz; lossy CMOS substrate; lossy silicon substrate; microstrip line; millimetre wave transmission line; on-chip interconnection; on-chip transmission line; scalable compact model; size 0.18 mum; CMOS integrated circuits; CMOS technology; Moment methods; Propagation losses; Semiconductor device modeling; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics, Circuits, and Systems (ICECS), 2010 17th IEEE International Conference on
Conference_Location :
Athens
Print_ISBN :
978-1-4244-8155-2
Type :
conf
DOI :
10.1109/ICECS.2010.5724559
Filename :
5724559
Link To Document :
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