DocumentCode
2666427
Title
Improved design of the BB-SoC which incorporated the ultra high speed multi level QAM modem for MM-wave radio systems, and its performance
Author
Kojima, Kazuya ; Toriyama, Yasuhiro ; Nagayasu, Masatoshi ; Taniguchi, Toru
Author_Institution
R&D Center, Japan Radio Co., Ltd., Tokyo, Japan
fYear
2010
fDate
12-15 Dec. 2010
Firstpage
515
Lastpage
518
Abstract
With the aim of application to the broadband radio transmission systems using millimeter wave, we have been developing a baseband signal processing SoC (System-On-Chip). Until now, we developed the SoC that has the high-speed multi-level QAM (Quadrature Amplitude Modulation) modem (modulator and demodulator) that opetates on single-carrier TDD (Time Division Duplex), radio symbol frequency of 200 MHz, and 16QAM. In this work, for more high-capacity, we have upgraded the resolution for ADCs (Analog-to-Digital Converters) and DACs (Digital-to-Analog Converters) built in the SoC, have developed a new SoC which applied to 64QAM. Further, we analyzed about the degradation factor of modulation and demodulation performance in this SoC, and acquired the prospect of realization of the radio transmission systems with an effective throughput of 1 Gbps.
Keywords
analogue-digital conversion; broadband networks; demodulators; digital-analogue conversion; millimetre wave devices; modems; quadrature amplitude modulation; system-on-chip; BB-SOC; TDD single-carrier; analog-to-digital converters; baseband signal processing SoC; broadband radio transmission systems; demodulator; digital-to-analog converters; frequency 200 MHz; millimeter wave; mm-wave radio systems; quadrature amplitude modulation; radio transmission systems; system-on-chip; time division duplex; ultra high speed multi level QAM modem; Demodulation; Ethernet networks; Ions; Modems; System-on-a-chip; Broadband communication; Millimeter wave radio communication; Quantization; Radio communication; Timing jitter;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics, Circuits, and Systems (ICECS), 2010 17th IEEE International Conference on
Conference_Location
Athens
Print_ISBN
978-1-4244-8155-2
Type
conf
DOI
10.1109/ICECS.2010.5724562
Filename
5724562
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