DocumentCode
2667502
Title
[Front cover]
fYear
2010
fDate
5-7 May 2010
Abstract
The following topics are dealt with: MEMS/MOEMS; numerical simulation and modelling; reliability and testing; RF MEMS; sensors; compact and behavioral modelling; actuators; CAD; microfabrication, integration and packaging; embossing and mould; large area manufacturing; value and packaging; assembly and packaging; control and read-out architectures for MEMS and NEMS.
Keywords
CAD; actuators; assembling; embossing; micro-optomechanical devices; microfabrication; moulding; nanoelectromechanical devices; packaging; reliability; sensors; CAD; MOEMS; NEMS; RF MEMS; actuators; assembly; embossing; large area manufacturing; microfabrication; moulding; numerical modelling; numerical simulation; packaging; read-out architectures; reliability; sensors; testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on
Conference_Location
Seville
Print_ISBN
978-1-4244-6636-8
Type
conf
Filename
5486469
Link To Document