• DocumentCode
    2668503
  • Title

    Highly integrated packet-based AER communication infrastructure with 3Gevent/S throughput

  • Author

    Hartmann, S. ; Schiefer, S. ; Scholze, S. ; Partzsch, I. ; Mayr, C. ; Henker, S. ; Schüffny, R.

  • Author_Institution
    Dept. of Parallel VLSI Syst. & Neural Circuits, Tech. Univ. Dresden, Dresden, Germany
  • fYear
    2010
  • fDate
    12-15 Dec. 2010
  • Firstpage
    950
  • Lastpage
    953
  • Abstract
    One of the main challenges in large scale neuromorphic VLSI systems is the design of the communication infrastructure. Traditionally, the neural communication has been done via parallel asynchronous transmission of Address-Event-Representations (AER) of pulses, while the configuration was achieved via off-the-shelf chip connect protocols. Recently, there has been a move towards greater event transmission speed via a serialization of the AER protocols, as well as an integration of both communication and configuration in the same interface. We present the PCB and FPGA design of such an interface for a newly developed waferscale neuromorphic system. The serial event communication of other current approaches has been refined into a packet based synchronous (rather than asynchronous) protocol, which offers better flexibility and bandwidth utilization. A factor 30-100 greater event transmission rate has been achieved. Compared to other approaches, the full communication bandwidth can also be employed for configuration. The system offers additional functionality, such as event storage and replay. Also, a very high degree of mechanical integration has been achieved.
  • Keywords
    VLSI; field programmable gate arrays; logic design; neural nets; printed circuit design; protocols; 3Gevent-S throughput; AER protocol serialization; FPGA design; PCB design; address event representations; communication infrastructure design; event storage; event transmission speed; highly-integrated packet-based AER communication infrastructure; large-scale neuromorphic VLSI systems; mechanical integration; neural communication; off-the-shelf chip connect protocols; packet-based synchronous protocol; parallel asynchronous transmission; serial event communication; waferscale neuromorphic system; Connectors; Ethernet networks; Field programmable gate arrays; Indexes; Media; Transceivers; FPGA event routing; Gigaevent serial AER; configuration over AER; packet-based AER;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics, Circuits, and Systems (ICECS), 2010 17th IEEE International Conference on
  • Conference_Location
    Athens
  • Print_ISBN
    978-1-4244-8155-2
  • Type

    conf

  • DOI
    10.1109/ICECS.2010.5724670
  • Filename
    5724670