DocumentCode
2668681
Title
Testing system-in-package wirelessly
Author
Bernard, Serge ; Andreu, David ; Flottes, Marie-Lise ; Cauvet, Philippe ; Fleury, Hervé ; Verjus, Fabrice
Author_Institution
LIRMM, Montpellier Univ.
fYear
2006
fDate
5-7 Sept. 2006
Firstpage
222
Lastpage
226
Abstract
The paper shows a new concept for testing a system-in-package (SiP) using a wireless communication. Trends of the SiP technology put more economic and technical constraints onto the test, while the contactless test techniques represent an opportunity to overcome the inherent problems. In this paper, we introduce a new test concept based on a wireless communication, a specific test access mechanism (TAM), and an optimised architecture. Although this approach is dedicated to an intermediate test of SiP, we explore other potential applications of this technology
Keywords
integrated circuit testing; system-in-package; SiP technology; contactless test techniques; system-in-package testing; test access mechanism; wireless communication; Assembly; Computer aided manufacturing; Decoding; Electronic equipment testing; Electronics packaging; Manufacturing processes; Radio frequency; Semiconductor device testing; System testing; Wireless communication;
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Test of Integrated Systems in Nanoscale Technology, 2006. DTIS 2006. International Conference on
Conference_Location
Tunis
Print_ISBN
0-7803-9726-6
Type
conf
DOI
10.1109/DTIS.2006.1708683
Filename
1708683
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