Additivity of capacitive and inductive coupling in submicronic interconnects

Author

Lorival, J.E. ; Deschacht, D. ; Quere, Y. ; Le Gouguec, T. ; Huret, F.

Author_Institution

Lab. d´´Informatique de Robotique et de Microeiectronique de Mompellier, UMR CNRS, Montpellier

fYear

2006

fDate

5-7 Sept. 2006

Firstpage

300

Lastpage

304

Abstract

Constant evolution in integrated circuit technology has led to an increase in the switching speed of the digital chip. As a result, there is a growing interest in the inductance associated with signal lines. Inductive coupling effects on interconnects is an emerging concern in high performance digital integrated circuits. Based on an RLC transmission line model, associated to each propagation mode, a new crosstalk noise model is proposed to evaluate both the capacitive and the inductive coupling. The additivity of the coupling is shown and validated with several simulations

Keywords

digital integrated circuits; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; transmission lines; RLC transmission lines; coupling effects; crosstalk noise; digital integrated circuits; integrated circuit interconnects; propagation modes; switching speed; Circuit simulation; Coupling circuits; Crosstalk; Degradation; Distributed parameter circuits; Inductance; Integrated circuit interconnections; Integrated circuit technology; Very large scale integration; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Design and Test of Integrated Systems in Nanoscale Technology, 2006. DTIS 2006. International Conference on

Conference_Location

Tunis

Print_ISBN

0-7803-9726-6

Type

conf

DOI

10.1109/DTIS.2006.1708701

Filename

1708701