• DocumentCode
    2669267
  • Title

    Avionics reliability-cost (ARC) trade-off model

  • Author

    Sjovold, Arve R. ; Nordsieck, Richard A. ; Scarano, Gina M.

  • Author_Institution
    Tecolote Research Inc., Santa Barbara, CA, USA
  • fYear
    1990
  • fDate
    21-25 May 1990
  • Firstpage
    1050
  • Abstract
    The avionics reliability-cost (ARC) program is configured as a design aid for advanced technology avionics. It is intended to be used early in the design process to aid the designer in searching for cost-effective avionics implementations. The focus of the model is on technology advances promised by the next generation of integrated circuits typified by phase-one and, ultimately, phase-two VHSIC (very high-speed integrated circuits). The model is designed to allow the study of trade-offs involving all phases of life-cycle cost. ARC facilitates design-cost trade-off analysis by modeling interactions among selected device characteristics and packaging, environmental, and operational variables. ARC carefully models device power dissipation; module thermal loads; heat conductivity as a function of module size, heat sink, and material choices; and consequent device junction temperatures and failure rates. The same device and module characteristics that are used to deduce failure rates are used to estimate module costs through calibrated engineering buildup relationships. ARC runs interactively, allowing the user to create data sets, calculate, view, and print results, and save and edit old data sets as different parameter combinations are evaluated during a single ARC session. All actions are menu-driven, and context-sensitive help screens are provided to assist the new user
  • Keywords
    CAD; aerospace computing; aircraft instrumentation; economics; failure analysis; heat sinks; packaging; reliability; user interfaces; VHSIC; context-sensitive help screens; cost-effective avionics implementations; design-cost trade-off analysis; device junction temperatures; failure rates; heat conductivity; heat sink; interactions; life-cycle cost; material choices; menu-driven; packaging; power dissipation; thermal loads; very high-speed integrated circuits; Aerospace electronics; Costs; Heat sinks; High speed integrated circuits; Integrated circuit modeling; Integrated circuit reliability; Integrated circuit technology; Process design; Thermal conductivity; Very high speed integrated circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace and Electronics Conference, 1990. NAECON 1990., Proceedings of the IEEE 1990 National
  • Conference_Location
    Dayton, OH
  • Type

    conf

  • DOI
    10.1109/NAECON.1990.112912
  • Filename
    112912