DocumentCode :
2669945
Title :
Silicon nanofabrication technologies for compact integrated receivers working at THz frequencies
Author :
Jung, C. ; Lee, C. ; Chattopadhyay, G. ; Siles, J. ; Reck, T. ; Lin, R. ; Cooper, K. ; Mehdi, I.
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
fYear :
2011
fDate :
2-7 Oct. 2011
Firstpage :
1
Lastpage :
2
Abstract :
Silicon nanofabrication technologies provide precise dimensional control and batch processing capability. These features have been exploited to enable novel active and passive components in the submillimeter-wave region. We report on silicon micromachined methodologies that will enable large format submillimeter-wave heterodyne arrays and 3-D integration of the whole receiver front-end.
Keywords :
batch processing (industrial); micromachining; nanofabrication; silicon; THz frequency; batch processing; compact integrated receiver; dimensional control; receiver front-end; silicon micromachined methodologies; silicon nanofabrication; submillimeter-wave heterodyne arrays; submillimeter-wave region; Instruments; Mixers; Optical transmitters; Optical waveguides; Receivers; Silicon; Transceivers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Infrared, Millimeter and Terahertz Waves (IRMMW-THz), 2011 36th International Conference on
Conference_Location :
Houston, TX
ISSN :
2162-2027
Print_ISBN :
978-1-4577-0510-6
Electronic_ISBN :
2162-2027
Type :
conf
DOI :
10.1109/irmmw-THz.2011.6104765
Filename :
6104765
Link To Document :
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