DocumentCode :
2670136
Title :
The effect of elevated temperature on digital single event transient pulse widths in a bulk CMOS technology
Author :
Gadlage, M.J. ; Ahlbin, J.R. ; Narasimham, B. ; Ramachandran, V. ; Dinkins, C.A. ; Bhuva, B.L. ; Schrimpf, R.D. ; Shuler, R.L.
Author_Institution :
Vanderbilt Univ., Nashville, TN, USA
fYear :
2009
fDate :
26-30 April 2009
Firstpage :
170
Lastpage :
173
Abstract :
Combinational logic soft errors are expected to be the dominant reliability issue for advanced technologies. One of the major factors affecting the soft-error rates is single-event transient (SET) pulse widths. The SET pulse widths, which are controlled by drift, diffusion, and parasitic bipolar transistor parameters, are a strong function of operating temperature. In this work, heavy-ion induced SET pulse widths are reported at temperatures ranging from 25deg to 100degC with an autonomous SET capture circuit. Experimental and simulation results in a 90 nm bulk CMOS technology indicate an increase as high as 37% in average SET pulse width with increasing operating temperature, with some pulses almost 2 ns long at higher temperatures. The increase in the SET pulse width can be explained by the dependence of bipolar amplification on temperature.
Keywords :
CMOS digital integrated circuits; transient analysis; bipolar amplification; bulk CMOS technology; combinational logic soft error; digital single event transient pulse width; elevated temperature effect; heavy-ion induced SET pulse widths; operating temperature; parasitic bipolar transistor parameter; size 90 nm; temperature 25 degC to 100 degC; Bipolar transistors; CMOS logic circuits; CMOS technology; Circuit simulation; Pulse amplifiers; Pulse circuits; Space vector pulse width modulation; Temperature control; Temperature dependence; Temperature distribution; SER; SET; pulse width; radiation environment; single event; single event transient; soft error; temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 2009 IEEE International
Conference_Location :
Montreal, QC
ISSN :
1541-7026
Print_ISBN :
978-1-4244-2888-5
Electronic_ISBN :
1541-7026
Type :
conf
DOI :
10.1109/IRPS.2009.5173246
Filename :
5173246
Link To Document :
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