Title :
Reliability of high performance standard two-edge and radiation hardened by design enclosed geometry transistors
Author :
McLain, Michael L. ; Barnaby, Hugh J. ; Esqueda, Ivan S. ; Oder, Jonathan ; Vermeire, Bert
Author_Institution :
Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
Abstract :
It was recently shown that radiation hardened by design (RHBD) annular-gate MOSFETs not only provide total dose radiation tolerance, but can also improve the hot-carrier reliability of advanced CMOS circuits. In this paper, the hot-carrier reliability of standard two-edge and enclosed geometry transistors intended for use in space and strategic environments is demonstrated. Hot-carrier reliability measurements on standard two-edge, standard enclosed, gate under-lap enclosed, and annular transistors fabricated in the same 90 nm high performance technology indicate an improvement in hot-carrier lifetime in the enclosed geometry and multi-finger transistor designs when compared to a conventional single stripe MOSFET. Two-dimensional device simulations, along with experimental measurements, provide physical insight into the reliability response of each device type.
Keywords :
MOSFET; hot carriers; nanofabrication; radiation hardening (electronics); semiconductor device measurement; semiconductor device reliability; annular transistor fabrication; annular-gate MOSFET; enclosed geometry transistors; gate under-lap enclosed transistors; high-performance standard two-edge geometry; hot-carrier lifetime improvement; hot-carrier reliability measurement; multifinger transistor design; radiation hardening; size 90 nm; two-dimensional device simulation; CMOS technology; Circuits; Geometry; Hot carriers; MOSFETs; Measurement standards; Radiation hardening; Space technology; Transistors; Voltage; Enclosed geometry transistors; hot-carrier reliability; radiation hardened by design (RHBD); total ionizing dose;
Conference_Titel :
Reliability Physics Symposium, 2009 IEEE International
Conference_Location :
Montreal, QC
Print_ISBN :
978-1-4244-2888-5
Electronic_ISBN :
1541-7026
DOI :
10.1109/IRPS.2009.5173247