Title :
Qualification issues and pitfalls for advanced semiconductor devices in space
Author :
Sunderland, David A.
Author_Institution :
Boeing Space & Intell. Syst., El Segundo, CA, USA
Abstract :
Increasing satellite performance within size, weight and power constraints demands access to advanced semiconductors, yet environmental, reliability and schedule requirements remain. Successful technology insertion requires knowledge of failure mechanisms, design limitations and screening flow. We review Boeing´s approach, critical issues and potential pitfalls, illustrated by experience with IBM ASICs.
Keywords :
application specific integrated circuits; failure analysis; radiation hardening (electronics); semiconductor device reliability; space vehicle electronics; Boeing´s approach; IBM ASIC; failure mechanism; radiation hardening; satellite performance; semiconductor device reliability; spacecraft electronics; Electronics packaging; Failure analysis; Integrated circuit packaging; Integrated circuit reliability; Integrated circuit technology; Power system reliability; Qualifications; Satellites; Semiconductor devices; Space technology; ASICs; integrated circuits; programmable devices; qualification; radiation effects; radiation hardening; reliability; spacecraft electronics; technology insertion;
Conference_Titel :
Reliability Physics Symposium, 2009 IEEE International
Conference_Location :
Montreal, QC
Print_ISBN :
978-1-4244-2888-5
Electronic_ISBN :
1541-7026
DOI :
10.1109/IRPS.2009.5173254
