Surface mount solder joint issues impacting avionic integrity

Author

Lingg, Cynthia L.

Author_Institution

Aeronaut. Systems Div., Wright-Patterson AFB, OH, USA

fYear

1990

fDate

21-25 May 1990

Firstpage

1369

Abstract

Some issues affecting surface mount solder joint life are addressed. Solder joint life expectancy depends on the level of stress experienced and the number of cycles of stress. Service life within a surface mount solder fillet follows mechanical failure models. These models predict failure at a predetermined number of cycles for different stress levels in the solder fillet. Fatigue in surface mount devices, castellations and surface finishes, life predictions, design criteria, manufacturing processes and controls, accelerated fatigue testing, and quality assurance provisions for solder joints are discussed. Each topic is introduced with a question expressing a concern relating to avionics integrity

Keywords

aerospace testing; aircraft instrumentation; fatigue testing; life testing; reliability; soldering; surface mount technology; accelerated fatigue testing; aerospace testing; avionic integrity; controls; life predictions; manufacturing processes; mechanical failure models; quality assurance; service life; solder fillet; stress; stress levels; surface mount devices; surface mount solder joint life; Aerospace electronics; Fatigue; Flip chip solder joints; Manufacturing processes; Predictive models; Process control; Process design; Soldering; Stress; Surface finishing;

fLanguage

English

Publisher

ieee

Conference_Titel

Aerospace and Electronics Conference, 1990. NAECON 1990., Proceedings of the IEEE 1990 National

Conference_Location

Dayton, OH

Type

conf

DOI

10.1109/NAECON.1990.112975

Filename

112975