DocumentCode :
2670602
Title :
Electron beam induced current investigation of stress-induced leakage and breakdown processes in high-k stacks
Author :
Chen, Jun ; Sekiguchi, Takashi ; Fukata, Naoki ; Takase, Masami ; Chikyow, Toyohiro ; Hasunuma, Ryu ; Yamabe, Kikuo ; Sato, Motoyuki ; Nara, Yasuo ; Yamada, Keisaku
Author_Institution :
Adv. Electron. Mater. Center, Nat. Inst. for Mater. Sci. (NIMS), Tsukuba, Japan
fYear :
2009
fDate :
26-30 April 2009
Firstpage :
333
Lastpage :
338
Abstract :
We report dynamic and microscopic investigations of electrical stress induced defects in a high-k/metal gate stack by electron beam induced current (EBIC). The correlation between dielectric breakdown and EBIC sites are reported. A systematic study was performed on pre-existing and electrical stress induced defects. These defects are successfully visualized. The origin of pre-existing defects is discussed, comparing different gate electrodes and their temperature-dependence.
Keywords :
EBIC; MOSFET; high-k dielectric thin films; semiconductor device breakdown; semiconductor device reliability; EBIC; MOSCAPs; MOSFETs; dielectric breakdown; electrical stress induced defects; electron beam induced current; high-k-metal gate stack; Dielectric breakdown; Electric breakdown; Electron beams; High K dielectric materials; High-K gate dielectrics; MOSFETs; Materials science and technology; Physics; Stress; Tin; CVS; EBIC; High-k;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 2009 IEEE International
Conference_Location :
Montreal, QC
ISSN :
1541-7026
Print_ISBN :
978-1-4244-2888-5
Electronic_ISBN :
1541-7026
Type :
conf
DOI :
10.1109/IRPS.2009.5173274
Filename :
5173274
Link To Document :
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