Title :
Thermal behaviour and reliability of solidly mounted Bulk Acoustic Wave Duplexers under high power RF loads
Author :
van der Wel, P.J. ; Wunnicke, O. ; de Bruijn, F. ; Strijbos, R.C.
Author_Institution :
Quality & Anal. Services, NXP Semicond., Nijmegen, Netherlands
Abstract :
In this paper, the reliability requirements, thermal behaviour and failure mechanisms of solidly mounted Bulk Acoustic Wave (BAW) filters are studied. High power RF stress measurements are presented where the evolution of the surface damage of the BAW filters as a function of stress time is analysed by optical height profiling. Two different metal stacks were used. The main failure mechanism for BAW filters during high RF power stress is proposed to be acoustomigration. By comparing the stress measurements to the requirements, excellent reliability of NXP´s BAW duplexers is proven.
Keywords :
acoustic filters; bulk acoustic wave devices; failure analysis; reliability; BAW filters; acoustomigration; bulk acoustic wave duplexers; bulk acoustic wave filters; failure mechanisms; high power RF loads; high power RF stress measurements; optical height profiling; reliability; solid mounting; thermal behaviour; Acoustic waves; Cellular phones; Degradation; Electrodes; Failure analysis; Optical filters; Piezoelectric films; Radio frequency; Resonator filters; Thermal loading; AlN; BAW filters; Bulk Acoustic Waves; Duplexer; MEMS; SBAR;
Conference_Titel :
Reliability Physics Symposium, 2009 IEEE International
Conference_Location :
Montreal, QC
Print_ISBN :
978-1-4244-2888-5
Electronic_ISBN :
1541-7026
DOI :
10.1109/IRPS.2009.5173310
