DocumentCode :
2671214
Title :
ESD stress in RF-MEMS capacitive switches: The influence of dielectric material deposition method
Author :
Ruan, J. ; Papaioannou, G.J. ; Nolhier, N. ; Bafleur, M. ; Coccetti ; Plana, R.
Author_Institution :
CNRS, LAAS, Toulouse, France
fYear :
2009
fDate :
26-30 April 2009
Firstpage :
568
Lastpage :
572
Abstract :
The present work investigates the influence of dielectric film deposition method on the charging behavior of RF-MEMS capacitive switches, stressed by electrostatic discharges. A transmission line pulsing generator is used to produce the short transient event. The results show two simplified charging mechanisms influenced by discharges. The comparison between two silicon nitride confirms the effect of the dielectric material deposition method on the reliability of the switches.
Keywords :
dielectric materials; electrostatic discharge; microswitches; pulse generators; stress analysis; transmission lines; ESD stress; RF-MEMS capacitive switches; dielectric films; dielectric material deposition method; electrostatic discharges; silicon nitride; switch reliability; transmission line pulsing generator; Dielectric films; Dielectric materials; Electrostatic discharge; Materials reliability; Power system transients; Radiofrequency microelectromechanical systems; Silicon; Stress; Switches; Transmission lines; RF-MEMS; charging; dielectric material; electrostatic discharge (ESD); reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 2009 IEEE International
Conference_Location :
Montreal, QC
ISSN :
1541-7026
Print_ISBN :
978-1-4244-2888-5
Electronic_ISBN :
1541-7026
Type :
conf
DOI :
10.1109/IRPS.2009.5173312
Filename :
5173312
Link To Document :
بازگشت