Title :
Embedded powerPC 405 & 440-based SoC product qualifications on 45°-rotated substrates
Author :
Nsame, Pascal ; Tang, George ; Viau, Ernie ; Outama, Khambay ; Nigussie, Teddy ; Dunston, Claude ; Sziklas, Edward ; Goth, George ; Graas, Carole
Author_Institution :
IBM Syst. & Technol. Group, Essex Junction, VT, USA
Abstract :
We discuss functionality, performance, power and reliability evaluations of the world´s first SoC products fabricated using IBM 90 nm technology on a 45deg-rotated substrate. We have demonstrated reliable product operational lifetimes with up to 12% improved across die delay variability including 30% product performance improvement and 33% leakage reduction over nonrotated substrate.
Keywords :
CMOS digital integrated circuits; integrated circuit reliability; microprocessor chips; system-on-chip; 45deg-rotated substrates; SoC; die delay variability; embedded PowerPC 405; embedded PowerPC 440; operational lifetimes; reliability; size 90 nm; CMOS technology; Compressive stress; Delay; Dielectric substrates; Packaging; Power system reliability; Qualifications; Random access memory; Tensile stress; Testing;
Conference_Titel :
Reliability Physics Symposium, 2009 IEEE International
Conference_Location :
Montreal, QC
Print_ISBN :
978-1-4244-2888-5
Electronic_ISBN :
1541-7026
DOI :
10.1109/IRPS.2009.5173314
