• DocumentCode
    2671238
  • Title

    Embedded powerPC 405 & 440-based SoC product qualifications on 45°-rotated substrates

  • Author

    Nsame, Pascal ; Tang, George ; Viau, Ernie ; Outama, Khambay ; Nigussie, Teddy ; Dunston, Claude ; Sziklas, Edward ; Goth, George ; Graas, Carole

  • Author_Institution
    IBM Syst. & Technol. Group, Essex Junction, VT, USA
  • fYear
    2009
  • fDate
    26-30 April 2009
  • Firstpage
    579
  • Lastpage
    584
  • Abstract
    We discuss functionality, performance, power and reliability evaluations of the world´s first SoC products fabricated using IBM 90 nm technology on a 45deg-rotated substrate. We have demonstrated reliable product operational lifetimes with up to 12% improved across die delay variability including 30% product performance improvement and 33% leakage reduction over nonrotated substrate.
  • Keywords
    CMOS digital integrated circuits; integrated circuit reliability; microprocessor chips; system-on-chip; 45deg-rotated substrates; SoC; die delay variability; embedded PowerPC 405; embedded PowerPC 440; operational lifetimes; reliability; size 90 nm; CMOS technology; Compressive stress; Delay; Dielectric substrates; Packaging; Power system reliability; Qualifications; Random access memory; Tensile stress; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2009 IEEE International
  • Conference_Location
    Montreal, QC
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4244-2888-5
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2009.5173314
  • Filename
    5173314