DocumentCode
2671335
Title
Yield modeling and optimization of large redundant RAMs
Author
Ganapathy, Kumar N. ; Singh, Adit D. ; Pradhan, Dhiraj K.
Author_Institution
Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
fYear
1990
fDate
23-25 Jan 1990
Firstpage
273
Lastpage
287
Abstract
Presents and analyzes redundant large area TRAM architectures (64 to 512 Mbit) for variations in redundancy level and determine the optimal redundancy organization for yield enhancement. A hierarchical redundancy scheme is used for defect tolerance and the yield of the redundant RAM is modelled using a compounded Poisson model. Results are presented that show the tradeoff in local versus global redundancy schemes for TRAM
Keywords
VLSI; integrated circuit technology; integrated memory circuits; random-access storage; redundancy; 64 to 512 Mbit; ULSI; WSI RAM; WSI memory systems; compounded Poisson model; defect tolerance; global redundancy schemes; hierarchical redundancy scheme; large area VLSI; large redundant RAMs; local redundancy schemes; multimegabit RAM; optimal redundancy organization; redundancy level; redundant large area TRAM architectures; tradeoff; tree structured RAM; yield enhancement; yield modeling; yield optimisation; Semiconductor device modeling; Switches; Switching circuits; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Wafer Scale Integration, 1990. Proceedings., [2nd] International Conference on
Conference_Location
San Francisco, CA
Print_ISBN
0-8186-9013-5
Type
conf
DOI
10.1109/ICWSI.1990.63911
Filename
63911
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