DocumentCode
2671412
Title
Mapping systematic and random process variations using Light emission from Off-State Leakage
Author
Stellari, Franco ; Song, Peilin ; Weger, Alan J. ; Miles, Darrell L.
Author_Institution
IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
2009
fDate
26-30 April 2009
Firstpage
640
Lastpage
649
Abstract
In this paper, we present for the first time the use of an optical imaging technique that we have developed to map systematic and random variability effects across several phases of development of a new microprocessor chip fabricated with the latest IBM SOI 65 nm technology. The technique relies on the detection and subsequent analysis of the light emission from off-state leakage current (LEOSLC) by means of static imaging cameras, mounted on a microscope or other optical collection optics. The variability maps created using this method are very simple to generate and have been successfully verified by comparing them to data obtained by on-chip electrical sensors such, as process sensitive ring oscillators (PSROs), power supply currents, and test results. The visual representation is very helpful in picking up systematic effect and to measure the correlation distance of the variations.
Keywords
electric sensing devices; leakage currents; microprocessor chips; optical images; silicon-on-insulator; IBM SOI technology; light emission; microprocessor chip; microscope; off-state leakage current; on-chip electrical sensors; optical collection optics; optical imaging technique; power supply currents; process sensitive ring oscillators; random process variation; silicon-on-insulator; size 65 nm; static imaging cameras; systematic mapping; Cameras; Image analysis; Leak detection; Leakage current; Microprocessor chips; Optical imaging; Optical microscopy; Optical sensors; Random processes; Stimulated emission; emission microscopy; light emission from off state leakage current; systematic and random process variations;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2009 IEEE International
Conference_Location
Montreal, QC
ISSN
1541-7026
Print_ISBN
978-1-4244-2888-5
Electronic_ISBN
1541-7026
Type
conf
DOI
10.1109/IRPS.2009.5173323
Filename
5173323
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