DocumentCode
2671635
Title
Comprehensive physics-based breakdown model for reliability assessment of oxides with thickness ranging from 1 nm up to 12 nm
Author
Wu, Ernest Y. ; Suñé, Jordi ; Vollertsen, Rolf-Peter
Author_Institution
Microelectron. Div., IBM, Essex Junction, VT, USA
fYear
2009
fDate
26-30 April 2009
Firstpage
708
Lastpage
717
Abstract
The state-of-art understanding on the TBD voltage acceleration models in direct tunneling (DT) and Fowler-Nordheim (FN) regimes is thoroughly and carefully reviewed including recent work on thin oxides as well as historical publication database for thick oxides. The field-driven TBD exponential law is found to be inconsistent with many experimental findings. We present a comprehensive physics-based breakdown model, which separately takes the roles of tunneling current and defect generation efficiency into account, and it is consistent with many experimental findings for thickness from 1.0 nm to 12 nm. With these new advanced understandings, we can now resolve many controversies surrounding TBD voltage acceleration models for SiO2-based dielectrics. Finally, a practical solution of acceleration model for TDDB qualification is proposed.
Keywords
dielectric thin films; electric breakdown; reliability; silicon compounds; tunnelling; Fowler-Nordheim regimes; SiO2; comprehensive physics-based breakdown model; defect generation efficiency; dielectrics; direct tunneling; oxides; reliability assessment; size 1.0 nm to 12 nm; tunneling current; voltage acceleration models; Acceleration; Accelerometers; Breakdown voltage; Electric breakdown; High-K gate dielectrics; Life estimation; Microelectronics; Qualifications; Stress measurement; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2009 IEEE International
Conference_Location
Montreal, QC
ISSN
1541-7026
Print_ISBN
978-1-4244-2888-5
Electronic_ISBN
1541-7026
Type
conf
DOI
10.1109/IRPS.2009.5173335
Filename
5173335
Link To Document