• DocumentCode
    2671635
  • Title

    Comprehensive physics-based breakdown model for reliability assessment of oxides with thickness ranging from 1 nm up to 12 nm

  • Author

    Wu, Ernest Y. ; Suñé, Jordi ; Vollertsen, Rolf-Peter

  • Author_Institution
    Microelectron. Div., IBM, Essex Junction, VT, USA
  • fYear
    2009
  • fDate
    26-30 April 2009
  • Firstpage
    708
  • Lastpage
    717
  • Abstract
    The state-of-art understanding on the TBD voltage acceleration models in direct tunneling (DT) and Fowler-Nordheim (FN) regimes is thoroughly and carefully reviewed including recent work on thin oxides as well as historical publication database for thick oxides. The field-driven TBD exponential law is found to be inconsistent with many experimental findings. We present a comprehensive physics-based breakdown model, which separately takes the roles of tunneling current and defect generation efficiency into account, and it is consistent with many experimental findings for thickness from 1.0 nm to 12 nm. With these new advanced understandings, we can now resolve many controversies surrounding TBD voltage acceleration models for SiO2-based dielectrics. Finally, a practical solution of acceleration model for TDDB qualification is proposed.
  • Keywords
    dielectric thin films; electric breakdown; reliability; silicon compounds; tunnelling; Fowler-Nordheim regimes; SiO2; comprehensive physics-based breakdown model; defect generation efficiency; dielectrics; direct tunneling; oxides; reliability assessment; size 1.0 nm to 12 nm; tunneling current; voltage acceleration models; Acceleration; Accelerometers; Breakdown voltage; Electric breakdown; High-K gate dielectrics; Life estimation; Microelectronics; Qualifications; Stress measurement; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2009 IEEE International
  • Conference_Location
    Montreal, QC
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4244-2888-5
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2009.5173335
  • Filename
    5173335