DocumentCode :
2671635
Title :
Comprehensive physics-based breakdown model for reliability assessment of oxides with thickness ranging from 1 nm up to 12 nm
Author :
Wu, Ernest Y. ; Suñé, Jordi ; Vollertsen, Rolf-Peter
Author_Institution :
Microelectron. Div., IBM, Essex Junction, VT, USA
fYear :
2009
fDate :
26-30 April 2009
Firstpage :
708
Lastpage :
717
Abstract :
The state-of-art understanding on the TBD voltage acceleration models in direct tunneling (DT) and Fowler-Nordheim (FN) regimes is thoroughly and carefully reviewed including recent work on thin oxides as well as historical publication database for thick oxides. The field-driven TBD exponential law is found to be inconsistent with many experimental findings. We present a comprehensive physics-based breakdown model, which separately takes the roles of tunneling current and defect generation efficiency into account, and it is consistent with many experimental findings for thickness from 1.0 nm to 12 nm. With these new advanced understandings, we can now resolve many controversies surrounding TBD voltage acceleration models for SiO2-based dielectrics. Finally, a practical solution of acceleration model for TDDB qualification is proposed.
Keywords :
dielectric thin films; electric breakdown; reliability; silicon compounds; tunnelling; Fowler-Nordheim regimes; SiO2; comprehensive physics-based breakdown model; defect generation efficiency; dielectrics; direct tunneling; oxides; reliability assessment; size 1.0 nm to 12 nm; tunneling current; voltage acceleration models; Acceleration; Accelerometers; Breakdown voltage; Electric breakdown; High-K gate dielectrics; Life estimation; Microelectronics; Qualifications; Stress measurement; Tunneling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 2009 IEEE International
Conference_Location :
Montreal, QC
ISSN :
1541-7026
Print_ISBN :
978-1-4244-2888-5
Electronic_ISBN :
1541-7026
Type :
conf
DOI :
10.1109/IRPS.2009.5173335
Filename :
5173335
Link To Document :
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