DocumentCode
2671986
Title
Addressing IC component Quality and Reliability assurance challenges
Author
Wen, ShiJie ; Morusupalli, Rao R. ; Hartranft, Marc
Author_Institution
Component Quality & Technol., Cisco Syst., San Jose, CA, USA
fYear
2009
fDate
26-30 April 2009
Firstpage
810
Lastpage
813
Abstract
This paper highlights some of the key challenges for the quality and reliability of semiconductor components based on field return data and root cause Pareto analysis. Some key learnings are discussed. The paper also discusses the topic of the role of organizations, its tasks and infrastructure necessary to achieve the required IC component quality and reliability. Specific examples are discussed. In the second part of this paper we discuss and summarize some of the reliability challenges experienced from the perspective of a customer for fabless semiconductor companies.
Keywords
Pareto analysis; integrated circuit manufacture; integrated circuit reliability; quality control; semiconductor industry; IC component quality; IC component reliability; Pareto analysis; fabless semiconductor companies; semiconductor components; Circuit synthesis; Circuit testing; Data analysis; Flowcharts; Foundries; Materials testing; Qualifications; Semiconductor device reliability; Semiconductor materials; Single event upset; Fabless Semiconductor; Foundry; Reliability; Reliability Monitors; pre-silicon; quality; reliability; semiconductor component; single event effect;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2009 IEEE International
Conference_Location
Montreal, QC
ISSN
1541-7026
Print_ISBN
978-1-4244-2888-5
Electronic_ISBN
1541-7026
Type
conf
DOI
10.1109/IRPS.2009.5173356
Filename
5173356
Link To Document