DocumentCode :
2671986
Title :
Addressing IC component Quality and Reliability assurance challenges
Author :
Wen, ShiJie ; Morusupalli, Rao R. ; Hartranft, Marc
Author_Institution :
Component Quality & Technol., Cisco Syst., San Jose, CA, USA
fYear :
2009
fDate :
26-30 April 2009
Firstpage :
810
Lastpage :
813
Abstract :
This paper highlights some of the key challenges for the quality and reliability of semiconductor components based on field return data and root cause Pareto analysis. Some key learnings are discussed. The paper also discusses the topic of the role of organizations, its tasks and infrastructure necessary to achieve the required IC component quality and reliability. Specific examples are discussed. In the second part of this paper we discuss and summarize some of the reliability challenges experienced from the perspective of a customer for fabless semiconductor companies.
Keywords :
Pareto analysis; integrated circuit manufacture; integrated circuit reliability; quality control; semiconductor industry; IC component quality; IC component reliability; Pareto analysis; fabless semiconductor companies; semiconductor components; Circuit synthesis; Circuit testing; Data analysis; Flowcharts; Foundries; Materials testing; Qualifications; Semiconductor device reliability; Semiconductor materials; Single event upset; Fabless Semiconductor; Foundry; Reliability; Reliability Monitors; pre-silicon; quality; reliability; semiconductor component; single event effect;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 2009 IEEE International
Conference_Location :
Montreal, QC
ISSN :
1541-7026
Print_ISBN :
978-1-4244-2888-5
Electronic_ISBN :
1541-7026
Type :
conf
DOI :
10.1109/IRPS.2009.5173356
Filename :
5173356
Link To Document :
بازگشت