• DocumentCode
    2671986
  • Title

    Addressing IC component Quality and Reliability assurance challenges

  • Author

    Wen, ShiJie ; Morusupalli, Rao R. ; Hartranft, Marc

  • Author_Institution
    Component Quality & Technol., Cisco Syst., San Jose, CA, USA
  • fYear
    2009
  • fDate
    26-30 April 2009
  • Firstpage
    810
  • Lastpage
    813
  • Abstract
    This paper highlights some of the key challenges for the quality and reliability of semiconductor components based on field return data and root cause Pareto analysis. Some key learnings are discussed. The paper also discusses the topic of the role of organizations, its tasks and infrastructure necessary to achieve the required IC component quality and reliability. Specific examples are discussed. In the second part of this paper we discuss and summarize some of the reliability challenges experienced from the perspective of a customer for fabless semiconductor companies.
  • Keywords
    Pareto analysis; integrated circuit manufacture; integrated circuit reliability; quality control; semiconductor industry; IC component quality; IC component reliability; Pareto analysis; fabless semiconductor companies; semiconductor components; Circuit synthesis; Circuit testing; Data analysis; Flowcharts; Foundries; Materials testing; Qualifications; Semiconductor device reliability; Semiconductor materials; Single event upset; Fabless Semiconductor; Foundry; Reliability; Reliability Monitors; pre-silicon; quality; reliability; semiconductor component; single event effect;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2009 IEEE International
  • Conference_Location
    Montreal, QC
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4244-2888-5
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2009.5173356
  • Filename
    5173356