• DocumentCode
    267201
  • Title

    Numerical IGBT junction temperature calculation method for lifetime estimation of power semiconductors in the wind power converters

  • Author

    Gaoxian Li ; Xiong Du ; Pengju Sun ; Luowei Zhou ; Heng-Ming Tai

  • Author_Institution
    State Key Lab. of Power Transm. Equip. & Syst. Security & New Technol., Chongqing Univ., Chongqing, China
  • fYear
    2014
  • fDate
    5-8 Nov. 2014
  • Firstpage
    49
  • Lastpage
    55
  • Abstract
    Power converters are crucial components of the wind turbine generator system (WTGS), and the reliability of wind power converters is susceptible to power fluctuations of the WTGS. The accurate lifetime estimation of power semiconductors should consider the long-time mission profiles of the WTGS. However, the existing junction temperature calculation methods don´t meet the requirement for performance of accuracy and speed. Therefore, this paper proposes a junction temperature calculation method for insulated gate bipolar transistor (IGBT). The proposed method calculates the switching cycle junction temperature of IGBT modules based on the electro-thermal analogy, then the entire fundamental frequency junction temperature are obtained iteratively via consecutive switching cycles. Performance of accuracy and speed of the proposed method is evaluated through a case study of a 1.8 MW wind power converter. Performance comparison of the proposed method with the electrical-thermal simulation and the analytical calculation is also conducted. Results show that the proposed method ensures the calculation accuracy as the electrical-thermal simulation, but greatly reduces the computational time in comparison to the electro-thermal simulation method. This proposed method can be applied in the lifetime estimation of power semiconductors considering a long time mission profiles.
  • Keywords
    insulated gate bipolar transistors; iterative methods; power bipolar transistors; power generation reliability; switching convertors; wind power plants; wind turbines; WTGS; consecutive switching cycles; electrical-thermal simulation; electro-thermal analogy; fundamental frequency junction temperature; insulated gate bipolar transistor; iterative method; lifetime estimation; long-time mission profiles; numerical IGBT junction temperature calculation method; power fluctuations; power semiconductors; switching cycle junction temperature; wind power converter reliability; wind turbine generator system; Computational modeling; Insulated gate bipolar transistors; Junctions; Switches; Wind power generation; Wind speed; Wind turbines; analytical model; power semiconductors; thermal analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and Application Conference and Exposition (PEAC), 2014 International
  • Conference_Location
    Shanghai
  • Type

    conf

  • DOI
    10.1109/PEAC.2014.7037827
  • Filename
    7037827