Title :
TDDB lifetime of asymmetric patterns and its comprehension from percolation theory
Author :
Miyazaki, H. ; Kodama, D.
Author_Institution :
Process Dev. Dept., Renesas Technol. Corp., Itami, Japan
Abstract :
TDDB-lifetime distribution of asymmetric pattern (perpendicular-faced comb) was estimated using a 3-dimensional electrostatic model calculation and its statistical treatment based on the percolation theory. Nanometer-size small cells which represent the minimum unit of electric isolation are placed along the perimeter of an asymmetric pattern. In the model, a dielectric breakdown occurs when a series of defective cells form a path through the potential barrier. The local electric field near the cathode dictates the percolation-path length (tunneling distance). The model suggests that a negative bias at the pattern tips provides a shorter percolation path due to steep gradient of potential, resulting in a shorter lifetime. However, in contrast to the model predictions the experimental data do show only a small difference between positive and negative biases. Therefore, the theoretical estimation from the ideal electric field leads us too much shorter lifetime than the real case.
Keywords :
electric breakdown; integrated circuit interconnections; integrated circuit reliability; nanotechnology; percolation; statistical analysis; 3-dimensional electrostatic model calculation; TDDB lifetime of asymmetric patterns; electric field; electric isolation; nanometer-size small cell; percolation theory; percolation-path length; perpendicular-faced comb; statistical treatment; theoretical estimation; time-dependent dielectric breakdown; tunneling distance; Cathodes; Copper; Dielectric breakdown; Electrons; Electrostatics; Isolation technology; Life estimation; Lifetime estimation; Testing; Tunneling; TDDB; asymmetric pattern; copper; interconnect; percolation;
Conference_Titel :
Reliability Physics Symposium, 2009 IEEE International
Conference_Location :
Montreal, QC
Print_ISBN :
978-1-4244-2888-5
Electronic_ISBN :
1541-7026
DOI :
10.1109/IRPS.2009.5173357