Title :
Understanding barrier engineered charge-trapping NAND flash devices with and without high-K dielectric
Author :
Lue, Hang-Ting ; Lai, Sheng-Chih ; Hsu, Tzu-Hsuan ; Du, Pei-Ying ; Wang, Szu-Yu ; Hsieh, Kuang-Yeu ; Liu, Rich ; Lu, Chih-Yuan
Author_Institution :
Emerging Central Lab., Macronix Int. Co., Ltd., Hsinchu, Taiwan
Abstract :
Barrier engineered charge-trapping NAND flash (BE-CTNF) devices are extensively examined by theoretical modeling and experimental validation. A general analytical tunneling current equation for multi-layer barrier is derived using WKB approximation. The rigorously derived analytical form is valid for both electron and hole tunneling, as well as for any barrier composition. With this, the time evolution (Vt-time) of any BE-CTNF device during programming/erasing can be accurately simulated. The model is validated by experimental results from bandgap-engineered SONOS (BE-SONOS) and various structures using Al2O3 top-capping layer. Using this model, various structures of BE-CTNF with high-K tunneling or blocking dielectric are investigated. Furthermore, the low-field tunneling current for various structures are simulated, providing theoretical foundations for retention and read disturb optimization.
Keywords :
NAND circuits; WKB calculations; aluminium compounds; electron traps; flash memories; high-k dielectric thin films; hole traps; tunnelling; Al2O3; NAND flash devices; WKB approximation; analytical tunneling current equation; bandgap-engineered SONOS; charge trapping; electron tunneling; high-K blocking dielectric; high-K tunneling dielectric; hole tunneling; multi-layer barrier; top-capping layer; Aluminum oxide; Buffer layers; Charge carrier processes; Electrons; Equations; High K dielectric materials; High-K gate dielectrics; Nonvolatile memory; SONOS devices; Tunneling; BE-SONOS; Barrier Engineering; Charge-trapping device; NAND Flash; Tunneling; modeling;
Conference_Titel :
Reliability Physics Symposium, 2009 IEEE International
Conference_Location :
Montreal, QC
Print_ISBN :
978-1-4244-2888-5
Electronic_ISBN :
1541-7026
DOI :
10.1109/IRPS.2009.5173370