DocumentCode
2672269
Title
Cell endurance prediction from a large-area SONOS capacitor
Author
Lee, C.H. ; Tu, W.H. ; Gu, S.H. ; Wu, C.W. ; Lin, S.W. ; Yeh, T.H. ; Chen, K.F. ; Chen, Y.J. ; Hsieh, J.Y. ; Huang, I.J. ; Zous, N.K. ; Han, T.T. ; Chen, M.S. ; Lu, W.P. ; Chen, K.C. ; Wang, Tahui ; Lu, C.Y.
Author_Institution
Macronix Int. Co., Ltd., Hsinchu, Taiwan
fYear
2009
fDate
26-30 April 2009
Firstpage
891
Lastpage
892
Abstract
Endurance considerations induced by the degradation of top and bottom oxides are proposed for a SONOS memory. First, a correlation is found between the widespread C-V curves induced by interface generation and cycling numbers (cyc. #). Unlike VFB (accumulation region), VT (inversion region) shows a much severe shift. Interface state (Nit) is identified as a key factor even when a 2 nm bottom oxide is used. Moreover, charge to breakdown (QBD) for an ONO capacitor under positive and negative constant current stress (CCS) is investigated. Our study reveals that QBD of such stacks strongly depends on the top oxide thickness. A field enhancement induced by charges in a trapping nitride layer is the root cause. Based on Weibull statistics, the risk of dielectric breakdown for both blocking layers is then evaluated.
Keywords
capacitors; electric breakdown; statistical analysis; stress analysis; SONOS memory; Weibull statistics; cell endurance prediction; cycling numbers; dielectric breakdown; field enhancement; interface generation; interface state; large-area SONOS capacitor; negative constant current stress; size 2 nm; Capacitance-voltage characteristics; Capacitors; Carbon capture and storage; Degradation; Dielectric breakdown; Electric breakdown; Interface states; SONOS devices; Statistics; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2009 IEEE International
Conference_Location
Montreal, QC
ISSN
1541-7026
Print_ISBN
978-1-4244-2888-5
Electronic_ISBN
1541-7026
Type
conf
DOI
10.1109/IRPS.2009.5173373
Filename
5173373
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