Title :
Investigation of chip-package interaction-looking for more acceleration in product qualification tests
Author :
Kanert, Werner ; Pufall, Reinhard
Author_Institution :
Infineon Technol., Neubiberg, Germany
Abstract :
Chip-package interaction is a major concern for product reliability. Temperature cycling is a commonly used stress test to address this issue. The paper shows that temperature shock can substitute temperature cycling for certain failure mechanisms, thereby reducing stress times by a factor of 28 or even more.
Keywords :
chip scale packaging; failure analysis; integrated circuit reliability; integrated circuit testing; chip-package interaction investigation; failure mechanisms; product qualification tests; product reliability; semiconductor technologies; stress test; temperature cycling; temperature shock; Electric shock; Failure analysis; Feedback; Life estimation; Life testing; Packaging; Qualifications; Semiconductor materials; Temperature; Thermal stresses; Product qualification; chippackage interaction; product reliability; temperature cycling; temperature shock;
Conference_Titel :
Reliability Physics Symposium, 2009 IEEE International
Conference_Location :
Montreal, QC
Print_ISBN :
978-1-4244-2888-5
Electronic_ISBN :
1541-7026
DOI :
10.1109/IRPS.2009.5173379
