Title :
The Effect of Advanced Material on Multi-chip Module Electrical Properties
Author :
Hanzaz, Assia A.
Author_Institution :
Omar Al-Mukhtar Univ., Al-Bida, Libya
Abstract :
The materials and fabrication techniques determine the electrical resistivity, thermal conductivity, thermal expansion coefficient, dielectric constant, loss tangent and mechanical strength of the different grades of technique. Technique such as Multi-chip module which is an assembly in more than one integrated circuit (IC) is bare mounted on a common substrate. Different materials which are used in Multi-chip Module (MCM) technology change many characteristics such attenuation, loss tangent and Dielectric constant. In this paper some of advanced material in MCM technology is analyzed to see the characteristic of module. The technological materials properties are analyzed from the suggested MCM concept. The paper also shows high frequency performance, dielectric constant and Dissipation factor of the material used.
Keywords :
dielectric materials; integrated circuit manufacture; integrated circuit packaging; permittivity; IC; MCM; advanced material effect; dielectric constant; electrical resistivity; fabrication techniques; integrated circuit; mechanical strength; multichip module electrical properties; thermal conductivity; thermal expansion coefficient; Attenuation; Conductors; Copper; Dielectric constant; Laminates; Substrates; MCM (Multi-chip module); electrical properties; martial characteristic;
Conference_Titel :
Green Computing and Communications (GreenCom), 2010 IEEE/ACM Int'l Conference on & Int'l Conference on Cyber, Physical and Social Computing (CPSCom)
Conference_Location :
Hangzhou
Print_ISBN :
978-1-4244-9779-9
Electronic_ISBN :
978-0-7695-4331-4
DOI :
10.1109/GreenCom-CPSCom.2010.127