DocumentCode :
2672454
Title :
Minimization of the Thermal Interface Resistance of Power SMD Assemblies for High-Temperature Applications
Author :
Nicolics, J. ; Mündlein, M. ; Fasching, M.
Author_Institution :
Vienna Univ. of Technol., Vienna
fYear :
2006
fDate :
10-14 May 2006
Firstpage :
49
Lastpage :
54
Abstract :
Heat removal from power SMDs in a D2PAK package for high temperature applications is investigated. The components are mounted on a glass fiber reinforced (FR4) printed circuit board (PCB) by soldering whereby the solder pad for the D2PAK is realized as array of "thermal vias "for an improved conduction of the power loss from the component side to the bottom side of the PCB. A novel heat conduction foil as thermal interface materials (TIM) between PCB and a cooling block acts as electrical insulation. Thermal investigations of described set-ups based on simulation and measurements were carried out at an ambient temperature of 150degC and a cooling block temperature of 80degC in order to comply for ambient conditions as in an engine compartment of a car. Results were compared from set-ups with different pad geometry, different number of thermal vias (99, 143, and 224 per pad), and different TIM-foils. In either case an effective reduction of the thermal interface resistance could be obtained by enlarging the pad area with respect to the pad size of the SMD.
Keywords :
high-temperature electronics; printed circuits; soldering; surface mount technology; thermal management (packaging); thermal resistance; glass fiber reinforced printed circuit board; high temperature applications; power SMD assemblies; solder pad; thermal interface materials; thermal interface resistance; Assembly; Cooling; Glass; Minimization; Packaging; Printed circuits; Soldering; Temperature; Thermal conductivity; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Technology, 2006. ISSE '06. 29th International Spring Seminar on
Conference_Location :
St. Marienthal
Print_ISBN :
1-4244-0551-3
Electronic_ISBN :
1-4244-0551-3
Type :
conf
DOI :
10.1109/ISSE.2006.365358
Filename :
4215998
Link To Document :
بازگشت