DocumentCode
2672490
Title
Comparison of device degradation of n-type metal-induced laterally crystallized poly-Si TFTs with or without hydrogenation
Author
Wang, Mingxiang ; Hu, Chunfeng ; Zhou, Yan ; Xu, Meijuan
Author_Institution
Dept. of Microelectron., Soochow Univ., Suzhou, China
fYear
2009
fDate
26-30 April 2009
Firstpage
960
Lastpage
963
Abstract
Hydrogenation effect on reliability of n-type metal-induced laterally crystallized poly-Si TFTs is systematically evaluated by comparing device transfer and output characteristic degradation under both hot carrier (HC) and self-heating (SH) stresses. Under HC stress, hydrogenated device exhibits better stability in transfer characteristics, but worse stability in output characteristics. Under SH stress, hydrogenation leads to instability in both transfer and output characteristics. Under both stresses, very different degradation behaviors associated with hydrogenation are found, reflecting different degradation mechanism involved for hydrogenated devices.
Keywords
elemental semiconductors; hot carriers; hydrogenation; semiconductor device reliability; semiconductor thin films; silicon; thin film transistors; Si; degradation behaviors; hot carrier; hydrogenation; low temperature polysilicon thin film transistors; metal-induced lateral crystallization; n-type poly-Si TFTs; output characteristics; reliability; self-heating; transfer characteristics; Crystallization; Degradation; Hot carriers; Microelectronics; Plasma devices; Plasma temperature; Stability; Stress; Testing; Thin film transistors; hot carrier; hydrogenation; poly-Si TFTs; self-heating;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2009 IEEE International
Conference_Location
Montreal, QC
ISSN
1541-7026
Print_ISBN
978-1-4244-2888-5
Electronic_ISBN
1541-7026
Type
conf
DOI
10.1109/IRPS.2009.5173389
Filename
5173389
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