• DocumentCode
    2672561
  • Title

    Negative bias temperature instability of p-channel transistors with diamond-like carbon liner having ultra-high compressive stress

  • Author

    Liu, Bin ; Tan, Kian-Ming ; Yang, Ming-Chu ; Yeo, Yee-Chia

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore, Singapore
  • fYear
    2009
  • fDate
    26-30 April 2009
  • Firstpage
    977
  • Lastpage
    980
  • Abstract
    The negative bias temperature instability (NBTI) characteristics of p-channel field-effect transistors with diamond-like carbon (DLC) liner stressor having ultra-high compressive stress (>5 GPa) are investigated for the first time. Ultra-Fast Measurement (UFM) was employed for NBTI study. Power law slopes ranging from ~0.057 to ~0.070 are reported in this work. P-FETs with higher channel strain show greater threshold voltage shift (DeltaVth) than those with lower or no channel strain under the same gate voltage VGS stress condition. DeltaVth recovery-behavior of highly strained devices suggests that both charge trapping and interface trap degradation are enhanced by strain. Despite this, strained p-FETs with recessed SiGe S/D and DLC stressors are projected to have a NBTI lifetime exceeding 10 years at VG = -1 V, showing no severe reliability issues.
  • Keywords
    compressive strength; diamond-like carbon; field effect transistors; interface states; semiconductor device measurement; semiconductor device reliability; thermal stability; C; FET reliability; NBTI; charge trapping; diamond-like carbon liner; highly strained device; interface trap degradation; negative bias temperature instability; p-channel field-effect transistor; ultra-fast measurement; ultra-high compressive stress; Capacitive sensors; Compressive stress; Degradation; Diamond-like carbon; FETs; Negative bias temperature instability; Niobium compounds; Silicon germanium; Threshold voltage; Titanium compounds; DLC; NBTI; UFM;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2009 IEEE International
  • Conference_Location
    Montreal, QC
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4244-2888-5
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2009.5173394
  • Filename
    5173394