• DocumentCode
    2672585
  • Title

    Spin dependent recombination study of the atomic-scale effects of fluorine on the negative bias temperature instability

  • Author

    Ryan, J.T. ; Lenahan, P.M. ; Krishnan, A.T. ; Krishnan, S. ; Campbell, J.P.

  • Author_Institution
    Pennsylvania State Univ., University Park, PA, USA
  • fYear
    2009
  • fDate
    26-30 April 2009
  • Firstpage
    988
  • Lastpage
    991
  • Abstract
    Recent work has shown that the negative bias temperature instability (NBTI) can be significantly suppressed through the incorporation of fluorine in the gate oxide of pure SiO2 pMOSFETs. In this study, we use spin dependent recombination and standard gated diode current measurements to investigate the atomic-scale processes involved in fluorine´s suppression of NBTI. We find that fluorine can effectively passivate Si/SiO2 Pb0 center defect precursors, but is much less effective at passivating Si/SiO2 Pb1 center defect precursors. Since these two defects have significantly different densities of states, our results may be useful in modeling NBTI response in fluorinated oxide devices. Our results also provide a fundamental explanation for the observation that fluorination has a strong effect on NBTI in ldquopurerdquo SiO2 MOS devices, but is ineffective at reducing NBTI in nitrided oxide devices.
  • Keywords
    MOSFET; elemental semiconductors; semiconductor device reliability; semiconductor-insulator boundaries; silicon; silicon compounds; NBTI; Si-SiO2; atomic-scale effects; densities of states; fiuorination; gate oxide; negative bias temperature instability; pMOSFETs; spin dependent recombination; Atomic measurements; Current measurement; MOSFETs; Measurement standards; Negative bias temperature instability; Niobium compounds; Paramagnetic resonance; Radiative recombination; Spontaneous emission; Titanium compounds; Electron Spin Resonance; Fluorine; NBTI; Spin Dependent Recombination;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2009 IEEE International
  • Conference_Location
    Montreal, QC
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4244-2888-5
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2009.5173396
  • Filename
    5173396