DocumentCode
2672626
Title
Using ANSYS for three-dimensional electrical-thermal models for radio-frequency catheter ablation
Author
Tungjitkusolmun, Supan ; Cao, Hong ; Tsai, Jang-Zem ; Webster, John G.
Author_Institution
Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
Volume
1
fYear
1997
fDate
30 Oct-2 Nov 1997
Firstpage
161
Abstract
A three-dimensional finite element model was developed using ANSYS, a commercial finite element analysis software. The effect of temperature-dependent electrical and thermal conductivities to the FE model which incorporated cardiac muscle, blood, electrode and catheter body, was investigated in this study. Computer simulations were performed to calculate the temperature distribution during RF ablation. The authors compared the results of the two cases. For the first case, they used constant properties of the cardiac muscle. The ether case had varying temperature dependent properties. The maximum temperatures found in the cardiac tissue for both cases are significantly different. The lesion depth and volume were larger for the second case. However, the locations of the maximum temperature of both cases were the same. A careful examination of the heat-transfer system during RF ablation is needed
Keywords
bioelectric phenomena; blood; cardiology; digital simulation; finite element analysis; heat transfer; medical computing; muscle; patient treatment; physiological models; temperature distribution; thermal conductivity; ANSYS; cardiac arrhythmias; cardiac muscle; catheter body; commercial finite element analysis software; computer simulations; lesion depth; lesion volume; maximum temperature location; radio-frequency catheter ablation; therapeutic technique; three-dimensional electrical-thermal models; Blood; Catheters; Computer simulation; Electrodes; Finite element methods; Muscles; Radio frequency; Temperature dependence; Temperature distribution; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 1997. Proceedings of the 19th Annual International Conference of the IEEE
Conference_Location
Chicago, IL
ISSN
1094-687X
Print_ISBN
0-7803-4262-3
Type
conf
DOI
10.1109/IEMBS.1997.754492
Filename
754492
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