Title :
Soldering technology for optoelectronic packaging
Author :
Tan, Qing ; Lee, Y.C.
Author_Institution :
Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA
Abstract :
Soldering technology for optoelectronic packaging is reviewed by studying modules in four categories: solder assembly with no precision self-alignments, and self-aligned solder assembly with no, one or two mechanical stops. There have been at least 60 papers and 8 U.S. patents published between 1990 and 1995. In addition to die-attachments, soldering technology has been successfully demonstrated for precision alignments. However, some packaging issues may hamper the progress of its manufacturing insertion for wide applications. Four of the issues to be discussed are solder materials, fluxless reflow, design, and reliability. More studies on these issues are needed to support the advancement of optoelectronic packaging for low-cost, high-performance and high-reliability modules
Keywords :
flip-chip devices; integrated circuit reliability; integrated optoelectronics; optical couplers; optical interconnections; packaging; reflow soldering; reviews; semiconductor device reliability; die-attachments; fluxless reflow; mechanical stops; optoelectronic packaging; reliability; self-aligned assembly; solder assembly; soldering technology; Acceleration; Assembly systems; Costs; Light emitting diodes; Manufacturing; Materials reliability; Mechanical engineering; Optical waveguides; Packaging; Soldering;
Conference_Titel :
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3286-5
DOI :
10.1109/ECTC.1996.517371
