Comparing of flip-chip and wire-bonding interconnection

This paper discusses the thermo-mechanical stress rising in solder joints and wire-bonding connection with the using the program ANSYS. It describes the occurence of stress as a result of thermal expansion coefficient being dependent on temperature. It pays attention especially to examining the stress in flip-chip and wire-bonding interconnection depending on various materials of the samples in the different temperatures. The purpose is to define materials, which are the most reliable considering the rising stress. The aim of this paper is to improve reliability of semiconductor chip interconnection and to increase durability of these structures. The main object is determining the stress distribution in the solder joints and connection wires. The possible danger solder joint and wire crack is in the place with the maximal stress value.