Title :
Investigation of solder joints strength
Author :
Vasko, Cyril ; Ohera, Jiri ; Szendiuch, Ivan
Author_Institution :
Univ. of Technol., Brno
Abstract :
This paper deals with method for finding mechanical properties of solder joint. Basic aim is practical realization of one´s select method namely shear strength finish of solder joint and their thermal fatigue variants on ceramic substrate. The test is execution on testing components soldered by tin-lead and lead-free solder. Acquired characteristic can subserve to definition influencing factors of strength and reliability soldered joint on ceramic substrate, primarily soldered by lead-free solder.
Keywords :
ceramics; finishing; lead; mechanical properties; reliability; shear strength; soldering; substrates; tin; ceramic substrate; lead-free solder; mechanical properties; reliability; shear strength finish; solder joints strength; thermal fatigue variant; tin-lead solder; Assembly; Ceramics; Environmentally friendly manufacturing techniques; Fatigue; Lead; Manufacturing processes; Microelectronics; Soldering; Testing; Thermal stresses;
Conference_Titel :
Electronics Technology, 2006. ISSE '06. 29th International Spring Seminar on
Conference_Location :
St. Marienthal
Print_ISBN :
1-4244-0551-3
Electronic_ISBN :
1-4244-0551-3
DOI :
10.1109/ISSE.2006.365393
