The design on RF transceiver at 5 GHz band with package modeling

Author

Park, Bonghyuk ; Lee, Seungsik ; Ko, Jinho ; Kim, Jongmoon ; Kim, Jongwon

Author_Institution

Korea Electron. & Telecommun. Res. Inst., Daejeon, South Korea

Volume

3

fYear

2004

fDate

26-29 Sept. 2004

Firstpage

2143

Abstract

The paper describes a novel CMOS heterodyne architecture at 5 GHz band which is fabricated in 0.18 μm CMOS process operating from a power supply of 1.8 V. We designed the up-mixer, down-mixer and LNA for the 5 GHz band, and the VCO for the 2 GHz band related to our heterodyne architecture. The LPCC 24 pin package is used with package modeling and the 4 key blocks occupy a die area of about 1.5 mm². An off-chip power amplifier is to be used for overall power saving.

Keywords

CMOS analogue integrated circuits; MMIC amplifiers; MMIC mixers; UHF oscillators; electric potential; heterodyne detection; integrated circuit design; integrated circuit packaging; semiconductor device packaging; transceivers; voltage-controlled oscillators; 0.18 micron; 1.8 V; 2 GHz; 5 GHz; CMOS heterodyne architecture; LNA; RF transceiver design; VCO; down-mixer; off-chip power amplifier; package modeling; power supply; two-stage cascode amplifier; up-mixer; voltage controlled oscillator; CMOS process; Packaging; Power amplifiers; Radio frequency; Radiofrequency amplifiers; Semiconductor device modeling; Topology; Transceivers; Transmitters; Voltage-controlled oscillators;

fLanguage

English

Publisher

ieee

Conference_Titel

Vehicular Technology Conference, 2004. VTC2004-Fall. 2004 IEEE 60th

ISSN

1090-3038

Print_ISBN

0-7803-8521-7

Type

conf

DOI

10.1109/VETECF.2004.1400419

Filename

1400419