DocumentCode :
2673333
Title :
Development of a chip-based micromachined THz-spectrometer
Author :
Fu, Xiaohuan ; Attenkofer, Klaus ; Wong, Thomas T Y
Author_Institution :
Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
fYear :
2011
fDate :
2-7 Oct. 2011
Firstpage :
1
Lastpage :
2
Abstract :
We present a coplanar waveguide design with integrated photoconductive transceivers; the system is fabricated on a 1.4-μm-thick SiO2/Si3N4 membrane supported by a micromachined silicon substrate. LTG GaAs is used as photon absorbing material of the photoconductive switches allowing full electron mobility at strongly reduced carrier-lifetime. By combining this circuit with a bonded sample cell, we are able to measure transmitted, reflected intensity and its phase correlations. The system was characterized by theoretical calculation and simulations.
Keywords :
coplanar waveguides; electron mobility; gallium arsenide; membranes; photoconducting switches; terahertz wave spectra; transceivers; GaAs; SiO2-Si3N4; chip-based micromachined THz-spectrometer; coplanar waveguide design; electron mobility; integrated photoconductive transceivers; micromachined silicon substrate; phase correlations; photoconductive switches; photon absorbing material; Attenuation; Coplanar waveguides; Electromagnetic waveguides; Permittivity; Resonant frequency; Silicon; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Infrared, Millimeter and Terahertz Waves (IRMMW-THz), 2011 36th International Conference on
Conference_Location :
Houston, TX
ISSN :
2162-2027
Print_ISBN :
978-1-4577-0510-6
Electronic_ISBN :
2162-2027
Type :
conf
DOI :
10.1109/irmmw-THz.2011.6104948
Filename :
6104948
Link To Document :
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