Development of a chip-based micromachined THz-spectrometer

Author

Fu, Xiaohuan ; Attenkofer, Klaus ; Wong, Thomas T Y

Author_Institution

Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA

fYear

2011

fDate

2-7 Oct. 2011

Firstpage

1

Lastpage

2

Abstract

We present a coplanar waveguide design with integrated photoconductive transceivers; the system is fabricated on a 1.4-μm-thick SiO₂/Si₃N₄ membrane supported by a micromachined silicon substrate. LTG GaAs is used as photon absorbing material of the photoconductive switches allowing full electron mobility at strongly reduced carrier-lifetime. By combining this circuit with a bonded sample cell, we are able to measure transmitted, reflected intensity and its phase correlations. The system was characterized by theoretical calculation and simulations.

Keywords

coplanar waveguides; electron mobility; gallium arsenide; membranes; photoconducting switches; terahertz wave spectra; transceivers; GaAs; SiO₂-Si₃N₄; chip-based micromachined THz-spectrometer; coplanar waveguide design; electron mobility; integrated photoconductive transceivers; micromachined silicon substrate; phase correlations; photoconductive switches; photon absorbing material; Attenuation; Coplanar waveguides; Electromagnetic waveguides; Permittivity; Resonant frequency; Silicon; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Infrared, Millimeter and Terahertz Waves (IRMMW-THz), 2011 36th International Conference on

Conference_Location

Houston, TX

ISSN

2162-2027

Print_ISBN

978-1-4577-0510-6

Electronic_ISBN

2162-2027

Type

conf

DOI

10.1109/irmmw-THz.2011.6104948

Filename

6104948