DocumentCode
2673509
Title
Cost Effective Design for Six Sigma in Component Placement
Author
Janóczki, Mihály ; Illés, Balázs
Author_Institution
Budapest Univ. of Technol. & Econ., Budapest
fYear
2006
fDate
10-14 May 2006
Firstpage
428
Lastpage
433
Abstract
The size decreison of passive components nowadays reaches 01005 dimension. For larger components also, but for these tiny components the accuracy of the component placement machines is a very important variable in respect of the placement quality. There are other variables that affect the placement quality (the quality of the solder paste, or the adhesive etc.), but I only studied the methods, that could improve the accuracy of the placement machines. It was a very important aspect that I use the method that is suggested in the standard: IPC-9850, but not to use expensive, special optical CMM (Calibrated Measuring Machine), and not to use expensive tester components (QFP, R, C, etc.) either.
Keywords
printed circuit manufacture; process capability analysis; quality assurance; statistical process control; surface mount technology; IPC-9850 standard; calibrated measuring machine; component placement; cost effective design; placement quality; six sigma; solder paste quality; statistical process control; surface mount technology; Costs; Gaussian processes; Inspection; Power generation economics; Process control; Production; Reactive power; Six sigma; Statistics; Surface-mount technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology, 2006. ISSE '06. 29th International Spring Seminar on
Conference_Location
St. Marienthal
Print_ISBN
1-4244-0551-3
Electronic_ISBN
1-4244-0551-3
Type
conf
DOI
10.1109/ISSE.2006.365143
Filename
4216073
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