MCM and bare chip technology for a wide range of computers

For a versatile MCM packaging technology with bare chip interconnection, an adequate patterned substrate and efficient cooling have been developed. A lineup of MCMs from a high-end supercomputer to a low-end portable PC are arranged by the combination of flip-chip and substrate technologies. More than thirty kinds of MCMs have been developed and are in production. These MCMs are classified into MCM-D and MCM-L, which are applied to both bare flip-chip devices of area bump and peripheral bump type. This effective combination of MCM technology for a wide range computers is discussed in this paper