Title :
The contact phenomena test method for the reliability and life span of electromechanical components
Author :
Hayashi, Masanoli ; Mano, Kunio
Author_Institution :
Mano Res. & Dev. Tech. Center, Nagoya, Japan
Abstract :
A concept for evaluating the reliability and life span of electromechanical components is proposed. Contact resistance phenomena are important factors in defining the degree of reliability and life span of electromechanical components. The special characteristics of the contact resistance phenomena are shown; and the investigation of those characteristics of the contact phenomena which are correlated to the reliability and life span of electronic components is discussed. The random cycle test method for the estimation of the degree of reliability and the period of life span for electromechanical components is described. The random cycle method is used because it is more practical than the constant cycle method to estimate the reliability and life span of electromechanical components. A random cycle test method measuring system utilizing a microcomputer is proposed to estimate the true value of the reliability and life span for both the electromechanical dynamic components and the static components
Keywords :
contact resistance; electric connectors; life testing; relays; reliability; switches; connectors; contact phenomena test method; contact resistance phenomena; electromechanical dynamic components; electromechanical static components; life span evaluation; life span of electromechanical components; life span of electronic components; random cycle test method; relays; reliability evaluation; switches; Connectors; Contact resistance; Electrical resistance measurement; Electronic components; Electronic equipment testing; Life estimation; Life testing; Mechanical variables measurement; Research and development; System testing;
Conference_Titel :
Electrical Contacts, 1990. Proceedings of the Thirty-Sixth IEEE Holm Conference on ... and the Fifteenth International Conference on Electrical Contacts
Conference_Location :
Montreal, Que.
DOI :
10.1109/HOLM.1990.113042
