DocumentCode :
2675565
Title :
A planar chip antenna for 2.4/5.2GHz ISM band applications
Author :
Fang, Chih-Yi ; Cheng, Li-Sheng ; Li, Jen-Hsun ; Yang, Chang-Fa ; Lin, Jun-Hong ; Liao, Chang-Lun ; Chen, Chia-Hung ; Lin, Shun-Tian ; Cheng, Kuo-Chung ; Wang, Sea-Fue ; Pan, Meng-Chiu ; Hu, Chun-Ling ; Chien, Yu-Ching
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ. of Sci. & Technol., Taipei
fYear :
2005
fDate :
8-8 July 2005
Firstpage :
455
Abstract :
A planar chip antenna for applications in the 2.4/5.2 GHz dual ISM bands is presented in this summary. A software package, XFDTD has been applied to design the chip antenna having dimensions of 8 mm (L) times 5 mm (W) times 0.6 mm (H). An insert molding approach is applied to manufacture the antenna, where meandered metal strips are enclosed with liquid crystal polyester (LCP) to form the chip antenna. Thus, this chip antenna comprises a radiating structure of multiple meandered conducting strips packed with an LCP dielectric composite material to achieve size, performance characteristics and cost effectiveness superior to other designs. The 8times5times0.6 mm3 compact surface mountable chip antenna is fully compatible with hand- and reflow-attachment processes. Also, no additional impedance-matching circuit is required so that the occupied length of the antenna on PCB is just 8 mm for the 2.4/5.2 GHz ISM band applications
Keywords :
UHF antennas; antenna radiation patterns; microwave antennas; planar antennas; 0.6 mm; 2.4 GHz; 5 mm; 5.2 GHz; 8 mm; ISM band applications; compact surface mountable chip antenna; dielectric composite material; liquid crystal polyester; multiple meandered conducting strips; planar chip antenna; radiating structure; Antenna measurements; Bandwidth; Chemical technology; Loss measurement; Materials science and technology; Packaging; Semiconductor device measurement; Software packages; Surface impedance; Wireless LAN;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Antennas and Propagation Society International Symposium, 2005 IEEE
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-8883-6
Type :
conf
DOI :
10.1109/APS.2005.1551591
Filename :
1551591
Link To Document :
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