• DocumentCode
    2675755
  • Title

    New experimental approaches for the characterization of compliant press-fit pins in plated-through holes

  • Author

    Yost, B. ; Li, C.-Y. ; Brodsky, W.L. ; Pokrzywa, R.S.

  • Author_Institution
    Cornell Univ., Ithaca, NY, USA
  • fYear
    1990
  • fDate
    20-24 Aug 1990
  • Firstpage
    599
  • Lastpage
    603
  • Abstract
    New experimental approaches are demonstrated to reveal more detailed physical characteristics that govern the performance and reliability of compliant press-fit pin/plated through hole assemblies as compared to common methods involving peak insertion and withdrawal force measurements. These approaches include: (1) measurement of the withdrawal force-displacement profile with high-speed techniques. (2) microdisplacement tests involving displacement in the micron range, and (3) long-term cyclic microdisplacement tests in a controlled environment. The results of these tests provide, respectively, information on: (1) the withdrawl energy and contact area. (2) the stiffness of the assembly, which relates to bond strength and contact area, and (3), the effects of fretting from thermal displacement cycles
  • Keywords
    electric connectors; electrical contacts; environmental testing; life testing; printed circuit accessories; reliability; CPFP; PCB connectors; PTH; bond strength; characterization; compliant press-fit pins in plated-through holes; contact area; controlled environment; detailed physical characteristics; effects of fretting; experimental approaches; long-term cyclic microdisplacement tests; microdisplacement tests; performance; reliability; stiffness; thermal displacement cycles; withdrawal force-displacement profile; withdrawl energy; Assembly; Bonding; Contacts; Copper alloys; Electronic equipment testing; Force measurement; Manufacturing; Pins; System testing; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Contacts, 1990. Proceedings of the Thirty-Sixth IEEE Holm Conference on ... and the Fifteenth International Conference on Electrical Contacts
  • Conference_Location
    Montreal, Que.
  • Type

    conf

  • DOI
    10.1109/HOLM.1990.113065
  • Filename
    113065