Title :
A Two-Tier Deembedding Technique for Packaged Transistors
Author :
Vaitkus, R. ; Scheitlin, D.
Abstract :
This paper describes a technique for deembedding transistor chip scattering parameters from the measurements of packaged devices in a standard transistor test fixture by the use of a set of secondary calibration standards, consisting of empty and specially wire-bonded transistor packages.
Keywords :
Calibration; Circuits; Error analysis; Error correction; Fixtures; Measurement standards; Microwave transistors; Packaging; Scattering parameters; Semiconductor device measurement;
Conference_Titel :
Microwave Symposium Digest, 1982 IEEE MTT-S International
Conference_Location :
Dallas, TX, USA
DOI :
10.1109/MWSYM.1982.1130708
