DocumentCode
2677144
Title
Micromachined probes for on-wafer characterization of terahertz and submillimeter-wave components
Author
Weikle, R.M., II ; Barker, N.S. ; Lichtenberger, A.W. ; Reck, T. ; Chen, L. ; Zhang, C. ; Arsenovic, A.I. ; Bauwens, M.F.
Author_Institution
Charles L. Brown Dept. of Electr. & Comput. Eng., Univ. of Virginia, Charlottesville, VA, USA
fYear
2011
fDate
2-7 Oct. 2011
Firstpage
1
Lastpage
2
Abstract
A micromachined coplanar waveguide probe for performing on-wafer measurements of planar devices in the WR-1.5 waveguide band (500-750 GHz) is described. The probe is fabricated using a silicon-on-insulator process and is scalable to terahertz frequencies.
Keywords
coplanar waveguides; micromachining; silicon-on-insulator; submillimetre wave devices; terahertz wave devices; micromachined coplanar waveguide probe; micromachined probes; on-wafer characterization; on-wafer measurements; planar devices; silicon-on-insulator process; submillimeter-wave components; terahertz components; Coplanar waveguides; Frequency measurement; Planar waveguides; Probes; Scattering parameters; Semiconductor device measurement; Transmission line measurements;
fLanguage
English
Publisher
ieee
Conference_Titel
Infrared, Millimeter and Terahertz Waves (IRMMW-THz), 2011 36th International Conference on
Conference_Location
Houston, TX
ISSN
2162-2027
Print_ISBN
978-1-4577-0510-6
Electronic_ISBN
2162-2027
Type
conf
DOI
10.1109/irmmw-THz.2011.6105162
Filename
6105162
Link To Document