Title :
Non-destructive, high resolution channel temperature measurements of compound semiconductor devices
Author :
Kim, Quiesup ; Kayali, Sammy A.
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
Abstract :
A technique based on infrared-emission spectroscopy has been found to be useful for non-contact measurement of the temperature of a hot spot in the gate channel of a GaAs metal/semiconductor field-effect transistor (MESFET). Temperature measurements are important for the development of high-power GaAs MESFET and other advanced semiconductor devices because hot spots can affect operation and reduce operational lifetimes. Passive infrared-sensing techniques provide temperature measurements with a spatial resolution of 15 μm, which is much too coarse for determining local distributions of temperature in state-of-the-art devices with submicron-sized gate structures. The present technique affords a spatial resolution of about 0.5 μm
Keywords :
III-V semiconductors; gallium arsenide; infrared spectroscopy; power MESFET; spectral methods of temperature measurement; 0.5 micron; GaAs; MEALS; compound semiconductor device; high power GaAs MESFET; hot spot; infrared emission spectroscopy; lifetime; noncontact measurement; nondestructive high resolution channel temperature measurement; passive infrared sensing; FETs; Gallium arsenide; Laser beams; MESFETs; Semiconductor device measurement; Semiconductor devices; Spatial resolution; Spectroscopy; Temperature dependence; Temperature measurement;
Conference_Titel :
GaAs Reliability Workshop, 1997., Proceedings
Conference_Location :
Anaheim, CA
Print_ISBN :
0-7908-0064-0
DOI :
10.1109/GAASRW.1997.656144