• DocumentCode
    2677413
  • Title

    Study of high temperature superconducting thin film with application in microwave circuits

  • Author

    Elkordy, M.

  • Author_Institution
    Dept. of Electr. Commun., Menoufia Univ., Egypt
  • fYear
    2003
  • fDate
    Oct. 28 2003-Nov. 1 2003
  • Firstpage
    742
  • Lastpage
    745
  • Abstract
    In this paper a numerical solution to the estimation of superconducting thin film surface impedance is presented. Integral equations are developed on the basis of Maxwell equation, Green function and two-fluid model. The solution of the integral equations gives the surface impedance of the superconducting thin film, which can be used in many applications in microwave circuits. It is found that the thin film surface impedance at microwave frequency dependent on the thickness of the substrate. A comparison with published experimental results for surface resistance is included to check the accuracy of this technique. The interaction of superconducting thin film with surface acoustic wave (SAW) in hybrid layer structure is studied as one application in microwave circuits. It is found that the results of the attenuation of SAW follow the experimental published results at the temperature transition to normal region.
  • Keywords
    Green´s function methods; Maxwell equations; integral equations; microwave circuits; substrates; superconducting thin films; surface acoustic waves; surface impedance; Green function; Maxwell equation; high temperature superconducting thin film; hybrid layer structure; microwave circuits; microwave frequency; surface acoustic wave; surface impedance; thin film surface impedance; two-fluid model; Green function; Integral equations; Maxwell equations; Microwave circuits; Superconducting thin films; Surface acoustic waves; Surface impedance; Surface resistance; Temperature; Thin film circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas, Propagation and EM Theory, 2003. Proceedings. 2003 6th International SYmposium on
  • Conference_Location
    Beijing, China
  • Print_ISBN
    0-7803-7831-8
  • Type

    conf

  • DOI
    10.1109/ISAPE.2003.1276793
  • Filename
    1276793